Particle Removal Mechanism in Ultrasonic Cleaning. Scrubbing Action by Resonant Bubbles.
نویسندگان
چکیده
منابع مشابه
Ultrasonic and Megasonic Particle Removal
Particulate surface contamination is one of the major causes of low yields in the semiconductor and other affected industries. The theory of low frequency (ultrasonic) and high frequency (megasonic) cleaning will be presented. Ultrasonic cleaning (less than 100 kHz) is relevant to cleaning of optics and precision parts. Megasonic cleaning (0.8 to 1.2 MHz) is used in semiconductor manufacturing....
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Freon-TF is no better a cleaning fluid than deionized water for removing either organic (polystyrene latex spheres) or inorganic (glass beads) particles from silicon wafer surfaces, as shown by comparative measurements of cleaning efficiencies in both an ultrasonic bath and a hydrodynamic cleaning apparatus. A primary reason for this lackluster performance is the higher van der Waals’ forces of...
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Resin blocks conta in ing s imula ted roo t canal spaces were c o m p a r e d with ext rac ted tee th as mode ls for measu r ing the eff ic iency of endodon t i c d e b r i d e m e n t with hand ins t rumenta t ion , u l t rasonica t ion , or a c o m b i n a t i o n of bo th techniques . Canal spaces were filled with r ad io i so tope l aden gelatin, and the loss of radioact iv i ty was measu r...
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ژورنال
عنوان ژورنال: Journal of the Surface Finishing Society of Japan
سال: 1996
ISSN: 0915-1869,1884-3409
DOI: 10.4139/sfj.47.37